Heat pipe and vapor chamber heat dissipation

ABSTRACT

The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

BACKGROUND

The present invention relates to heat dissipation, and more particularlyto heat pipe and vapor chamber heat dissipation.

SUMMARY

The present invention provides a heat dissipation device including (a) abaseplate, (b) one or more heat pipes in thermal communication with thebaseplate, where the one or more heat pipes has one or more internalcavities, (c) one or more vapor chambers coupled to the one or more heatpipes, where the one or more vapor chambers has one or more internalcavities, where the one or more internal cavities of the one or moreheat pipes and the one or more internal cavities of the one or more thevapor chambers are contiguous, where the one or more vapor chambersextends from the one or more heat pipes, and (d) one or more heatconducting fins coupled to the one or more vapor chambers, where the oneor more heat conducting fins extends from the one or more vaporchambers.

In a further embodiment, the present invention provides a method offabricating a heat dissipating device, the method including (a)positioning one or more heat pipes onto a baseplate, where the one ormore heat pipes is in thermal communication with the baseplate, wherethe one or more heat pipes has one or more internal cavities, (b)attaching one or more vapor chambers to the one or more heat pipes,where the one or more vapor chambers has one or more internal cavities,where the one or more internal cavities of the one or more heat pipes iscontiguous to the one or more internal cavities of the one or more vaporchambers (heat dissipation cavities), where the one or more vaporchambers extends from the one or more heat pipes, (c) putting fluid inthe heat dissipation cavities, and (d) attaching one or more heatconducting fins to the one or more vapor chambers, where the one or moreheat conducing fins extends from the one or more vapor chambers.

In a further embodiment, the present invention provides a method ofdissipating heat from an electronic component, the method including (a)positioning one or more heat pipes onto a baseplate, where the one ormore heat pipes is in thermal communication with the baseplate, wherethe one or more heat pipes has one or more internal cavities, (b)attaching one or more vapor chambers to the one or more heat pipe pipes,where the one or more vapor chambers has one or more internal cavities,where the one or more internal cavities of the one or more heat pipes iscontiguous to the one or more internal cavities of the one or more vaporchambers (heat dissipation cavities), where the one or more vaporchambers extends from the one or more heat pipes, (c) attaching one ormore heat conducting fins to the one or more vapor chambers, where theone or more heat conducing fins extends from the one or more vaporchambers, (d) putting fluid in the heat dissipation cavities, (e)installing the baseplate onto an electronic component, (f) applyingpressure to electronic component through the baseplate, (g) evaporatingthe fluid at an inner surface of the one or more heat pipes, and (h)condensing the fluid at an inner surface of the one or more vaporchambers.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A a perspective view of a heat dissipation device according to anembodiment of the present invention.

FIG. 1B is a cross-sectional view of a heat dissipation device accordingto an embodiment of the present invention.

FIG. 2A is a perspective view of a heat dissipation device according toan embodiment of the present invention.

FIG. 2B is a cross-sectional view of a heat dissipation device accordingto an embodiment of the present invention.

FIG. 3 is a flowchart according to an embodiment of the presentinvention.

FIG. 4 is a flowchart according to an embodiment of the presentinvention.

DETAILED DESCRIPTION

The present invention provides a heat dissipation device including (a) abaseplate, (b) one or more heat pipes in thermal communication with thebaseplate, where the one or more heat pipes has one or more internalcavities, (c) one or more vapor chambers coupled to the one or more heatpipes, where the one or more vapor chambers has one or more internalcavities, where the one or more internal cavities of the one or moreheat pipes and the one or more internal cavities of the one or more thevapor chambers are contiguous, where the one or more vapor chambersextends from the one or more heat pipes, and (d) one or more heatconducting fins coupled to the one or more vapor chambers, where the oneor more heat conducting fins extends from the one or more vaporchambers.

Problems with Heat Dissipation

Recent advances in performance and capacity in electronic devices,(i.e., computer systems, computer components, processors, and computerdevices) have led to an increase in total power consumption and specialpower density. In addition, the required I/O (Input/Output) pin densityhas also substantially increased due to wiring/interconnect densities.The increased I/O pin density has raised the loading pressure needed tosecurely seat these I/O pins. New fluidic thermal cooling advancementsare needed to address the thermal challenges of electronic circuitdevices while providing the increased pressure required to securely seatthe I/O pins.

In a conventional heat pipe heat sink thermal solution, bends in a heatpipe may be required to fan out the heat from the device and to extendto fins. Bending the heat pipe may put stress on the heat pipe, whichmay damage the heat pipe. The bends put a compressive stress at an innerportion of the bend and tensile stress at an outer portion of the bend.If the bend is too severe, the stress may damage the heat pipe walls andany internal wick structure. Likewise, the gap created by the bendseparates the heat pipe from the baseplate, preventing good thermalcontact and thereby limiting heat transfer from the baseplate to theheat pipe in that region. A heat pipe is a heat transfer device thattransfers heat by vaporizing water in one area of the heat pipe andcondensing it at another. After condensing, the liquid is transferredback to the hot area of the pipe in any suitable manner, includingcapillary action, centrifugal force, or gravity. A wick structure may beused in the heat pipe to facilitate the capillary action.

Some vapor chamber baseplates could have support structures or posts butthese could decrease the thermal transfer rate of the vapor chamber incritical areas. Traditionally fins are attached to heat pipes by edgebonding round heat pipes through a hole in the fins. This joint isdifficult to manufacture and not reliable. The soldered edge could bediscontinuous, thereby limiting thermal transfer anywhere there is abreak.

Modern processors could require a large force placed on them by acooling assembly to adequately engage the I/O pins of the processor. Ifthe load exceeds a load threshold of a cooling component in theassembly, it could damage or destroy the cooling apparatus. For example,a load plate could crush heat pipes and vapor cambers, rendering themineffective.

In an embodiment, the present invention circumvents this issue bysoldering or brazing one or more straight heat pipe segments to one ormore vapor chambers so that the one or more heat pipe segments do nothave to be bent. In an embodiment, the attachment of one or more heatpipes to one or more vapor chambers is done by any method that producesa thermally conductive interface. Likewise, soldering or brazing theheat pipe onto the vapor chamber allows any attachment angle (e.g., evenninety degrees) without a gap being formed at the edge. In anembodiment, the one or more vapor chambers is soldered or brazed to theone or more heat pipes. In one embodiment, the method includes solderingor brazing the one or more vapor chambers to the one or more heat pipes.

In an embodiment, heat pipes are strategically located in criticalcooling areas and islands, designed to take the load from a pressureplate and transfer it to the base plate, and are located in areas thatdo not need as much cooling. In an embodiment, one or more fins isbonded at a bent edge of the fin, onto the flat surface of a vaporchamber. In an embodiment, the present invention provides one or moreislands, next to one or more heat pipes, where the one or more islandsis designed to take the pressure directly from a load plate and transferit to the baseplate, thereby bypassing the heat pipes.

Heat Pipe and Vapor Chamber

Referring to FIG. 1A and FIG. 1B, FIG. 1B is a cross-sectional view ofFIG. 1A taken at cross-sectional line 3. In an embodiment, the presentinvention provides (a) a heat dissipating device 100, including one ormore heat pipes 110 in thermal communication with a baseplate 180, whereone or more heat pipes 110 has one or more internal cavities 115, (b)one or more vapor chambers 130 and 170 coupled to one or more heat pipes110, where one or more vapor chambers 130 and 170 has one or moreinternal cavities 135, where one or more internal cavities 115 of one ormore heat pipes 110 is contiguous to one or more internal cavities 135of one or more vapor chambers 130 and 170 (heat dissipation cavities),where one or more vapor chambers 130 and 170 extends from one or moreheat pipes 110, (c) one or more heat conducting fins 150 coupled to oneor more vapor chambers 130 and 170, where one or more heat conductingfins 150 extends from one or more vapor chambers 130 and 170. In anembodiment, one or more fins 150 is soldered to one or more flatportions of one or more vapor chambers 130 and 170.

In an embodiment, one or more fins 150 is be soldered along a bent sideedge 140 of one or more fins 150. In an embodiment, at least one of oneor more heat pipes 110, and at least one of one or more vapor chambers130 and 170 are hermetically interconnected and cooperatively form atleast one sealed chamber. In an embodiment, fins 150 are bonded at abent edge 140 of fin, onto the flat surface of a vapor chamber, therebyallowing for a more reliable bond to be made between bent edge 140 ofthe fin and the flat face of the vapor chamber.

In an embodiment, the present invention includes baseplate 180 with oneor more islands 120 formed on one surface. One or more islands 120 maybe configured to take compressive force applied to it by a load plate160. In an embodiment, load plate 160 is a u-shaped channel. Heat pipes110 are in the spaces formed next to islands 120. In an embodiment,islands 120 are configured to be in areas corresponding to low powerdensities of an electrical component. For example, for a multi-coreprocessor, the heat pipes could be placed directly over the center ofthe cores of the multi-core processor, while islands 120 could be placedover the area in-between the cores. In an embodiment, load plate 160 isabove baseplate 180, above one or more islands 120, and below one ormore fins 150, where one or more islands 120 is configured to provide amechanical load transfer path from load plate 160 to baseplate 180.

Referring to FIG. 2A and FIG. 2B, in an embodiment, the presentinvention provides a heat dissipation assembly 200 including a baseplate220 formed out of a thermally conductive metal. For example, baseplate220 could be formed out of copper, steel, or aluminum. In an embodiment,baseplate 220 is formed with cut-outs designed to fit heat pipes 210 andvapor chambers 240 inside the cut-outs. In an embodiment, baseplate 220has one or more cut-outs, and one or more heat pipes 210 is embedded inthe one or more cut-outs, where the walls of the one or more cut-outsform one or more islands 250. FIG. 2B is a cross sectional view of FIG.2A taken at cross section line 5. In an embodiment, one or more heatpipes 210 fits entirely in the cut-outs, and vapor chamber 240 fitspartially in the cut-outs. In an alternative embodiment, heat pipes 210fit partially in the cut-outs. In an embodiment, baseplate 220 ismachined to form the cut-outs. The areas next to the cut-outs areislands 250 configured to take compressive force applied to them by aload plate 230. In one example load plate 230 is pulled down at each endby spring structures and load screws. For example, load plate 230therefore could apply pressure to the area of baseplate 220 in-betweenheat pipes 210. To accomplish this, the cut-outs for heat pipes 210could be slightly larger than heat pipes 210. This would allow for asmall clearance between load plate 230 and heat pipes 210 and noclearance between load plate 230 and baseplate 220.

Referring to FIG. 3, in an embodiment, the present invention provides amethod 300 of fabricating a heat dissipating device including a step 310of positioning one or more heat pipes onto a baseplate, where the one ormore heat pipes is in thermal communication with the baseplate, wherethe one or more heat pipes has one or more internal cavities, a step 320of attaching one or more vapor chambers to the one or more heat pipes,where the one or more vapor chambers has one or more internal cavities,where the one or more internal cavities of the one or more heat pipes iscontiguous to the one or more internal cavities of the one or more vaporchambers, where the one or more vapor chambers extends from the one ormore heat pipes, a step 330 of putting fluid in the heat dissipationcavities, and a step 340 of attaching one or more heat conducting finsto the one or more vapor chambers, where the one or more heat conductingfins extends from the one or more vapor chambers.

In an embodiment, method 300 further includes forming the baseplate withcut-outs to accommodate the one or more heat pipes, and installing theone or more heat pipes in the one or more cut-outs, where the walls ofthe one or more cut-outs form one or more islands. In an embodiment, theone or more fins is soldered, along a bent side edge of the one or morefins, to one or more flat portions of the one or more vapor chambers. Ina further embodiment, method 300 includes installing a load plate abovethe baseplate, above the one or more islands, and below the one or morefins, where the one or more islands is configured to take pressureapplied to it via the load plate.

In an embodiment, the method further includes hermetically attaching atleast one of one or more heat pipes 110 to at least one of one or morevapor chambers 130 and 170, thereby cooperatively forming at least onesealed chamber. In an embodiment, the method further includes using athermally conductive paste to facilitate the thermal communication. Inan embodiment, the method further includes positioning one or more heatpipes 110 according to a power density of one or more electroniccomponents. In an alternative embodiment, the method includespositioning the one or more heat pipes according to a power density of atarget electrical component. For example, heat pipe assembly 100 couldbe designed so the heat pipes are directly over an area 190 with thehighest heat density.

Referring to FIG. 4, in an exemplary embodiment, the present inventionprovides a method 400 of dissipating heat from an electronic componentincluding a step 410 of positioning one or more heat pipes onto abaseplate, where the one or more heat pipes is in thermal communicationwith the baseplate, where the one or more heat pipes has one or moreinternal cavities, a step 420 of attaching one or more vapor chambers tothe one or more heat pipes, where the one or more vapor chambers has oneor more internal cavities, where the one or more internal cavities ofthe one or more heat pipes is contiguous to the one or more internalcavities of the one or more vapor chambers (heat dissipation cavities),where the one or more vapor chambers extends from the one or more heatpipes, a step 430 of attaching one or more heat conducting fins to theone or more vapor chambers, where the one or more heat conducing finsextends from the one or more vapor chambers, a step 440 of putting fluidin the heat dissipation cavities, a step 450 of installing the baseplateonto an electronic component, operation 460 of applying pressure to theelectronic component through the baseplate, a step 470 of evaporatingthe fluid at an inner surface of the one or more heat pipes, and a step480 of condensing the fluid at an inner surface of the one or more vaporchambers. In a further embodiment, the angle made by the one or moreheat pipes and one of the one or more vapor chambers is any suitableangle. In a further embodiment, the angle made by one of the one or morefins and one of the one or more vapor chambers is any suitable angle.For example, the angle made by the one or more heat pipes and one of theone or more vapor chambers is between 45 and 135 degrees. In a furtherembodiment, the angle made by one of the one or more fins and one of theone or more vapor chambers is between 45 and 135 degrees.

In a further embodiment, method 400 includes forming the baseplate withcut-outs to accommodate the one or more heat pipes, where one or moresolid material islands is formed between the one or more cut-outs, wherethe one or more islands is configured to take pressure applied to it,and installing a load plate above the baseplate, above the one or moreislands, and below the one or more fins, where the one or more islandsis configured to take pressure applied to it via the load plate.

In an embodiment, the heat pipes are round. In an embodiment, the heatpipes are rectangular. In an embodiment, the heat pipes have at leastone flat surface. In an embodiment, the heat pipes may be any size orshape. For example, rectangular heat pipes or heat pipes with at leastone flat surface could have a larger surface area engaged or nearlyengaged to the baseplate. A highly conductive thermal interface materialcould increase the thermal conductivity, but the thermal conductivitycould still be limited by the surface area at the interface. In anembodiment, a shaped heat pipe is used to increase the surface area atthe interface. The heat pipe could be formed with a rectangular crosssection. One of the flat surfaces could be bonded to the baseplate,thereby significantly increasing the surface area of the heat pipe incommunication with the baseplate. In a further embodiment, therectangular cross section has rounded edges. In an alternativeembodiment, the cross section of the heat pipe is substantially roundcross section with one or more flattened sides. In one embodiment, themethod includes soldering the one or more fins, along a bent side edgeof the one or more fins, to one or more flat portions of the one or morevapor chambers.

In an embodiment, the one or more heat pipes is in thermal communicationwith the baseplate through soldering, brazing, or using a highlyconductive thermal interface material. For example, thermalcommunication could mean, thermally coupled to, thermally in contactwith, or any other method of joining two parts that facilitates thermalconduction between the two parts. In an embodiment, the heat pipes areattached using a thermally conductive paste.

In an embodiment, two or more heat pipes are used, and all heat pipeshave the same thermal characteristics. In an embodiment, two or moreheat pipes are used, and at least one of the heat pipes has differentthermal characteristics from the other heat pipes. Thermalcharacteristics relate to the rate at which heat could be removed by theheat pipe. Thermal characteristics could be tied to one or moreproperties of the heat pipes. Thermal characteristics could relate toone or more of the following: (i) the material to make the heat pipe andor the vapor chamber, (ii) the material used to make the wick, (iii) thedesign of the wick, (iv) the type of the wick, (v) the fluid used in theheat pipe and vapor chamber, (vi) the size of the heat pipe, and (vii)the design of the heat pipe.

In an embodiment, the contiguous internal cavities are open to eachother. Fluid or vapor could move from the internal cavity of the heatpipe to the internal cavity of the vapor chamber, and fluid could movefrom the internal cavity of the vapor chamber to the internal cavity ofthe heat pipe. In one embodiment, internal cavity of the heat pipe andthe internal cavity of the vapor chamber are interconnected. In oneembodiment, the contiguous vapor chambers are hermetically sealed.

In an embodiment, the heat pipes could be positioned in any suitablemanner. In an embodiment, the one or more heat pipes is able to bepositioned according to a power density of one or more electricalcomponents. The one or more heat pipes could be positioned to bettercool the one or more electrical components. For example, if one of theone or more electrical components may have the highest power density, aheat pipe could be positioned to directly cover, and thereby moreeffectively cool, the component with the highest power density. In afurther embodiment, a low power density component of the one or morecomponents may not need a heat pipe positioned to cover the low powerdensity component. For example, the low power density component may notproduce enough heat to need a heat pipe positioned directly over it. Inan alternative embodiment, heat pipes with different thermalcharacteristics are positioned according to the power density of the oneor more components. For example, the heat pipes with the highest heattransfer coefficient could be positioned over the electrical componentwith the highest power density, and the heat pipe with the lowest heattransfer coefficient could be positioned over the component with thelowest power density.

In an embodiment, an arrangement with two or more heat pipes could stillbe able to function if one heat pipe became effectively inoperable ornon-functioning. For example, if the pressure buildup in the system wereto reach a critical point, a heat pipe could fail (e.g., balloon orbulge out, thereby separating the heat pipe from the baseplate).Ballooning may exacerbate the issue by limiting the effectiveness of theheat pipe or vapor chamber, thereby causing pressure to build up evenmore. In an embodiment, multiple heat pipes could limit the problemcaused by a single heat pipe. If one heat pipe were to fail, the otherheat pipes in the system could still operate and provide cooling to thedevice. In another example, if pressure were applied directly to theheat pipes, the heat pipes could be crushed, thereby limiting the flowthrough the heat pipes.

In an embodiment, an internal cavity of the vapor chamber isinterconnected to an internal cavity of the heat pipe. For example, suchan interconnection could allow for liquid vapor produced in the heatpipe to travel to the vapor chamber where could condenses on theinternal walls of the vapor chamber. Further, for example, the liquidcould then travel to the heat pipe through capillary action, gravity, orcentrifugal force, where the liquid could be vaporized again.

In an embodiment, the vapor chamber is substantially rectangular inshape. In an embodiment, the one or more vapor chambers has asubstantially rectangular cross section. The vapor chamber is where themajority of the vapor, produced by the one or more heat pipes,condenses. In an embodiment, the vapor chamber has support postspositioned at one or more strategic structural support points throughoutthe internal cavity.

In an embodiment, one or more fins are attached to the largest flatportions of the vapor chambers. In an embodiment, the fins have bentends at the attachment edge where the fins are attached to the vaporchamber. The flat side of the vapor chamber could be securely bonded tothe bent ends of the fins. This method of bonding is more secure thatbonding round heat pipes to copper fins. The fins are made of a materialwith a high thermal conductivity. For example, the fins may be made ofcopper.

In an embodiment, the material and fluid of the heat pipe are selectedto fit the desired application. In an embodiment, the material and fluidis selected from a group of copper and water working fluid, copper andRefrigerant R134a working fluid, steel and refrigerant R134a workingfluid, aluminum and ammonia working fluid, super alloy, and alkali metalworking fluid.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed:
 1. A heat dissipation device comprising: a baseplate; afirst heat pipe in thermal communication with the baseplate, wherein thefirst heat pipe has an internal cavity, wherein a first outer dimensionof the first heat pipe is more than five times a second outer dimensionof the first heat pipe and more than five time a third outer dimensionof the first heat pipe; a vapor chamber coupled to the first heat pipe,wherein the vapor chamber has an internal cavity, wherein a first outerdimension and a second outer dimension of the vapor chamber is more thanfive times a third outer dimension of vapor chamber, wherein theinternal cavity of the first heat pipe and the internal cavity of thevapor chamber are contiguous, wherein the vapor chamber extends from thefirst heat pipe; and one or more heat conducting fins coupled to thevapor chamber, wherein the one or more heat conducting fins extends fromthe vapor chamber.
 2. The heat dissipation device of claim 1 furthercomprising: a second heat pipe in thermal communication with thebaseplate; and an electronic component, attached to the baseplate, witha power density having first high heat density area and a second highheat density heat area, wherein the first heat pipe is positioned overthe first high heat density area, wherein the second heat pipe ispositioned over the second heat density area.
 3. The heat dissipationdevice of claim 2, wherein the baseplate has two cut-outs, wherein thefirst heat pipe is embedded in a first cut out of the two cut-outs,wherein the second heat pipe is embedded in a second cut out of the twocut-outs, wherein walls of the two cut-outs form one or more islands. 4.The heat dissipation device of claim 1, further comprising: a secondheat pipe in thermal communication with the baseplate, wherein thesecond heat pipe has an internal cavity, wherein the internal cavity ofthe second heat pipe and the internal cavity of the vapor chamber arecontiguous.
 5. The heat dissipation device of claim 4, wherein the firstheat pipe, the second heat pipe, and the vapor chamber are hermeticallyinterconnected and cooperatively form a sealed chamber.
 6. The heatdissipation device of claim 1, wherein the one or more fins is soldered,along a bent side edge of the one or more fins, to one or more flatportions of the vapor chamber.
 7. The heat dissipation device of claim1, wherein the vapor chamber is soldered to the first heat pipe.
 8. Theheat dissipation device of claim 1, wherein the vapor chamber has asubstantially rectangular cross section.
 9. A method of fabricating aheat dissipating device, the method comprising: positioning a first heatpipe onto a baseplate, wherein the first heat pipe is in thermalcommunication with the baseplate, wherein the first heat pipe has aninternal cavity, wherein a first outer dimension of the first heat pipeis more than five times a second outer dimension of the first heat pipeand more than five time a third outer dimension of the first heat pipe;attaching a vapor chamber to the first heat pipe, wherein the vaporchamber has an internal cavity, wherein a first outer dimension and asecond outer dimension of the vapor chamber is more than five times athird outer dimension of vapor chamber, wherein the internal cavity ofthe first heat pipe is contiguous to the internal cavity of the vaporchamber, wherein the vapor chamber extends from the first heat pipe;putting fluid in the contiguous cavity formed by the internal cavity ofthe first heat pipe and the internal cavity of the vapor chamber; andattaching one or more heat conducting fins to the vapor chamber, whereinthe one or more heat conducting fins extends from the vapor chamber. 10.The method of claim 9 further comprising positioning: positioning asecond heat pipe onto the baseplate, wherein the second heat pipe is inthermal communication with the baseplate; and attaching the baseplate toan electronic component, wherein the baseplate has a power densityhaving first high heat density area and a second high heat density heatarea; wherein the first heat pipe is positioned over the first high heatdensity area, wherein the second heat pipe is positioned over the secondheat density area.
 11. The method of claim 10, further comprising:forming the baseplate with two cut-outs to accommodate the first heatpipe and the second heat pipe; installing the first heat pipe in the twocut-outs; wherein the walls of the two cut-outs form one or moreislands.
 12. The method of claim 9, further comprising: positioning asecond heat pipe onto the baseplate, wherein the second heat pipe is inthermal communication with the baseplate, wherein the second heat pipehas an internal cavity, wherein the internal cavity of the second heatpipe and the internal cavity of the vapor chamber are contiguous. 13.The method of claim 9 further comprising hermetically attaching thefirst heat pipe and the second heat pipe to the vapor chamber, therebycooperatively forming a sealed chamber.
 14. The method of claim 9further comprising soldering the one or more fins, along a bent sideedge of the one or more fins, to one or more flat portions of the vaporchamber.
 15. The method of claim 9 further comprising soldering thevapor chamber to the first heat pipe.
 16. The method of claim 9 furthercomprising using a thermally conductive paste to facilitate the thermalcommunication.
 17. A method of dissipating heat from an electroniccomponent, the method comprising: positioning first heat pipe onto abaseplate, wherein the first heat pipe is in thermal communication withthe baseplate, wherein the first heat pipe has an internal cavity,wherein a first outer dimension of the first heat pipe is more than fivetimes a second outer dimension of the first heat pipe and more than fivetime a third outer dimension of the first heat pipe; attaching a vaporchamber to the first heat pipe, wherein the vapor chamber has aninternal cavity, wherein a first outer dimension and a second outerdimension of the vapor chamber is more than five times a third outerdimension of vapor chamber, wherein the internal cavity of the firstheat pipe is contiguous to the internal cavity of the vapor chamber,wherein the vapor chamber extends from the first heat pipe; attachingone or more heat conducting fins to the vapor chamber; wherein the oneor more heat conducting fins extends from the vapor chamber; puttingfluid in the contiguous cavity formed by the internal cavity of thefirst heat pipe and the internal cavity of the vapor chamber; installingthe baseplate onto an electronic component; applying pressure to anelectronic component through the baseplate; evaporating the fluid at aninner surface of the first heat pipe; and condensing the fluid at aninner surface of the vapor chamber.
 18. The method of claim 17 furthercomprising positioning: positioning a second heat pipe onto thebaseplate, wherein the second heat pipe is in thermal communication withthe baseplate; and attaching the baseplate to the electronic component,wherein the baseplate has a power density having first high heat densityarea and a second high heat density heat area; wherein the heat pipe ispositioned over the first high heat density area, wherein the secondheat pipe is positioned over the second heat density area.
 19. Themethod of claim 18, further comprising: forming the baseplate with twocut-outs to accommodate the first heat pipe and the second heat pipe,wherein one or more solid material islands is formed between the twocut-outs, wherein the one or more islands is configured to take pressureapplied to it.
 20. The method of claim 17 further comprising:positioning a second heat pipe onto the baseplate, wherein the secondheat pipe is in thermal communication with the baseplate, wherein thesecond heat pipe has an internal cavity, wherein the internal cavity ofthe second heat pipe and the internal cavity of the vapor chamber arecontiguous.